Home » CT300 High Frequency Copper Clad Laminates
Categories
News
Our newsletter
CT300 High Frequency Copper Clad Laminates
  • CT300 High Frequency Copper Clad Laminates
  • CT300 High Frequency Copper Clad Laminates
  • CT300 High Frequency Copper Clad Laminates
  • CT300 High Frequency Copper Clad Laminates
  • CT300 High Frequency Copper Clad Laminates

CT300 High Frequency Copper Clad Laminates

CT300 High Frequency CCL, CT300 HydroCarbon Polymer CCL
Detailed description

High Frequency Hydrocarbon Polymer Copper Clad Laminates

Model: CT300


Introduction: 

CT300 is laminated by hydrocarbon polymer and cermaic with a woven fiberglass reinforcement through scientific formulation and strict technology procedures. It is a kind of thermoset laminates, and the performance is consistent with foreigh similar products.This kind of laminates is applicable for the communication of 4G and 5G, Cellular Base Station Antennas ,WIMAX Antenna Network, Automotive Radarand Sensors, Power Amplifiers, Microwave Device,High Reliability Radar, Military communication device and soon.


Highlight:

1. The hydrocarbon polymer ceramic woven fiberglass is a thermosetting resin system, which has a better hardness than PTFE thermoplastic resin system, has a good loss value.

2. Excellent PIM performance

3. Dk, DF value is stable, DK/DF changes little with increase of frequency.

4. Good electrical performance, excellent thermal conductivity and be better insulation and heat treatment capability than PTFE materials.

5. It can be compatible with the process of FR-4, no need for plasma process. The process is relatively simple, compatible with most PP films.Besides, PCB process is good, especially suitable for the manufacturing of multilayer PCB.

6. Low thermal expansion co-efficient improves the reliablility of the plating through hole and dimensional stability.

7. Especially suitable for lead-free soldering process.


Specifications:

Types Double side
Dimensions (mm) 460*610(18''*24''), 915*1224(36''*48'')
For special dimension, customized laminates is available.
Dielectric constant 3.00±0.05
Thickness and Tolerance(mm) 0.508mm(20mil)±0.038mm(1.5mil)
Dielectric thickness can be customized.
Thickness of RTF copper foil RTF: 0.5OZ or 1OZ
Dissipation Factor (DF) @10GHZ     unit: tgδ   0.0029
Copper peel strength(1oz copper)  8.5N/cm
Surface Resistivity (M·Ω) Condition: Normal state (500V DC): ≥ 2×108
Volume Resistivity(MΩ.cm)  Condition: Normal state ≥ 3×108
Tg(ºC) Test condition:TMA; >280ºC
Td(ºC) Test condition: TGA,412
PIMD Test condition:2*43dBc; ≤ -158dBc
CTE(typical)  Condition: -55ºC to 288ºC (X Axis: 15; Y Axis: 14; Z Axis: 31)