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CT350 is laminated by hydrocarbon polymer and cermaic with a woven fiberglass reinforcement through scientific formulation and strict technology procedures. It is a kind of thermoset laminates, and the performance is consistent with foreigh similar products.This kind of laminates is applicable for the communication of 4G and 5G, Cellular Base Station Antennas ,WIMAX Antenna Network, Automotive Radarand Sensors, Power Amplifiers, Microwave Device,High Reliability Radar, Military communication device and soon.
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Highlight:
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1. The hydrocarbon polymer ceramic woven fiberglass is a thermosetting resin system, which has a better hardness than PTFE thermoplastic resin system, has a good loss value.
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2. Excellent PIM performance
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3. Dk, DF value is stable, DK/DF changes a little with increase of frequency.
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4. Good electrical performance, excellent thermal conductivity and be better insulation and heat treatment capability than PTFE materials.
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5. It can be compatible with the process of FR-4, no need for plasma process. The process is relatively simple, compatible with most PP films.Besides, PCB process is good, especially suitable for the manufacturing of multilayer PCB.
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6. Low thermal expansion co-efficient improves the reliablility of the plating through hole and dimensional stability.
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7. Especially suitable for lead-free soldering process.
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Specifications:
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Types
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Double side
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Dimensions (mm)
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460*610(18''*24''),500*600(19.69''*23.62''), 915*1224(36''*48'')
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For special dimension, customized laminates is available.
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Dielectric constant
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3.48±0.05
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Optional copper foil
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ED: 0.5OZ or 1OZ
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Dissipation factor
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@2.5GHZ unit: tgδ 0.0032
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@10GHZ unit: tgδ 0.0040
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Copper peel strength (1oz copper)
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>9N/cm
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Surface Resistivity ((M·Ω)
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@10GHZ unit: tgδ 0.0031
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Copper peel strength(1oz copper)
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7Condition: Normal state (500V DC) ≥ 4×108
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Volume Resistivity(MΩ.cm)
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Condition: Normal state ≥ 1×109
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Tg(ºC)
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Test condition:TMA; >280ºC
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Td(ºC)
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Test condition: TGA, 386
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CTE(typical)
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Condition: -55ºC to 288ºC (X Axis: 11; Y Axis: 14; Z Axis: 34)
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