CT330 High Frequency Copper Clad Laminates
| High Frequency Hydrocarbon Polymer Copper Clad Laminates | |
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Model: CT330
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| Introduction: | |
| CT330 is laminated by hydrocarbon polymer and cermaic with a woven fiberglass reinforcement through scientific formulation and strict technology procedures. It is a kind of thermoset laminates, and the performance is consistent with foreigh similar products. | |
| Applications: | |
| This kind of laminates is applicable for the communication of 4G and 5G,Cellular Base Station Antennas ,WIMAX Antenna Network,Automotive Radar and Sensors, Power Amplifiers, Microwave Device,High Reliability Radar,Military communication device and so on. | |
Specifications:
Types
Double side
Dimensions (mm)
460*610(18''*24''), 915*1224(36''*48'')
For special dimension, customized laminates is available.
Dielectric constant
3.30±0.06
Thickness and Tolerance(mm)
0.254mm(10mil)±0.0254mm(1mil)
Dielectric thickness can be customized.
Non-standard thickness starts from 0.254(10mil)increasing.
More than 3.05 mm (120mil), please contact us.
Thickness of RTF copper foil
ED: 0.5OZ or 1OZ
Dissipation Factor
@10GHZ unit: tgδ 0.0026
Copper peel strength(1oz copper)
8N/cm
Surface Resistivity (M·Ω)
Condition: Normal state (500V DC): ≥ 6×108
Volume Resistivity(MΩ.cm)
Condition: Normal state ≥ 5×109
Tg(ºC)
Test condition:TMA; >280ºC
PIMD
Test condition: 2*43dBc; ≤-157dBc
CTE(typical)
Condition: -55ºC to 288ºC (X Axis: 15; Y Axis: 13; Z Axis: 39)
