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CT330Z High Frequency Copper Clad Laminates

CT330Z High Speed CCL, High Frequency hydrocarbon polymer Copper-clad Laminates

Detailed description

High Frequency Hydrocarbon Polymer Copper Clad Laminates

Model: CT330Z

Introduction:

CT330Z is laminated by hydrocarbon polymer and cermaic with a woven fiberglass reinforcement through scientific formulation and strict technology procedures. It is a kind of thermoset laminates, and the performance is consistent with foreigh similar products.

Applications:

This kind of laminates is applicable for the communication of 4G and 5G,Cellular Base Station Antennas ,WIMAX Antenna Network,Automotive Radar and Sensors, Power Amplifiers, Microwave Device,High Reliability Radar,Military communication device and so on.

Specifications:
Types	Double side
Dimensions (mm)	460610(18''24''), 9151224(36''48'')
Dimensions (mm)	For special dimension, customized laminates is available.
Dielectric constant	3.00±0.05
Thickness and Tolerance(mm)	0.508mm(20mil)±0.038mm(1.5mil)
Thickness and Tolerance(mm)	Dielectric thickness can be customized.
Thickness of RTF copper foil	RTF: 0.5OZ or 1OZ
Dissipation Factor (DF)	@10GHZ unit: tgδ 0.0029
Copper peel strength(1oz copper)	8.5N/cm
Surface Resistivity (M·Ω)	Condition: Normal state (500V DC): ≥ 2×10⁸
Volume Resistivity(MΩ.cm)	Condition: Normal state ≥ 3×10⁸
Tg(ºC)	Test condition:TMA; >280ºC
Td(ºC)	Test condition: TGA,412
PIMD	Test condition:2*43dBc; ≤ -158dBc
CTE(typical)	Condition: -55ºC to 288ºC (X Axis: 15; Y Axis: 14; Z Axis: 31)